The efficiency of SMT chip processing has many aspects. For example, if the overall production volume is constant and the number of SMT chip production lines is large, the production speed can also be increased. However, the operating costs are also increasing. Now the fierce competition in the electronics industry is unimaginable. In the case of the existing placement production line, it is fundamental to increase the placement rate and win customer satisfaction. The following briefly introduces the placement rate factors and improvement measures:

The placement production line mainly consists of screen printing machine, high-speed placement machine, multi-function placement machine, reflow soldering machine and AOI automatic detector. If two placement machines complete a placement process (hereinafter referred to as placement time) When they are equal, it will affect the patch rate, the specific method:

1. Load distribution is balanced. Reasonably allocate the number of two placement components to achieve a balanced load distribution so that the placement time of the two placement machines is equal;

2, the placement machine itself. We all know that the placement machine itself has a maximum placement speed value, but it is generally not easy to achieve this value, which has a certain relationship with the placement machine's own structure, for example, X/Y structure placement The measures taken is to make the placement head pick up components at the same time as much as possible. On the other hand, when arranging the placement program, arrange the same type of components together to reduce the number of nozzle changes when the placement head picks up components and save the placement. Install time.

The SMT patch production line is composed of many equipment. If any piece of equipment is processing, if the speed is slow, it will delay the placement time and affect the actual processing process. How to improve is not only guided by theory, but also rich in on-site operators experience.