After the DIP plug-in, wave soldering and manual soldering are required to fix the components on the PCB. What are the main reasons for the virtual soldering during wave soldering?

Possible Causes:
1. The surface of the PCB is not clean, the surface is oxidized or is contaminated by dirt, grease, hand sweat, etc., resulting in poor solderability or even unsoldering of the surface;
2. The solderability of circuit boards (PCBs) and components purchased by the purchasing department are unqualified, and strict warehousing acceptance tests have not been carried out before entering the warehouse;
3. Poor inventory environment (the temperature, humidity and other external factors that the warehouse should keep are inappropriate), and the inventory period is too long;
4. The reason of the wave soldering furnace itself is that the temperature in the soldering furnace is too high, which causes the surface of the solder and the base material to oxidize and reduces the adhesion of the surface to the liquid solder. Moreover, the high temperature also corrodes the rough surface of the base material, which reduces the capillary action and deteriorates the flowability.

Measures to prevent false welding:
1. In terms of procurement, we must strictly check the purchased PCB boards and components to ensure their solderability.
2. Improve the warehouse environment, maintain proper temperature, humidity and no corrosive gases.
3, PCB boards and components must ensure the first-in-first-out principle to avoid quality problems caused by storage for too long.
4. The operator must take anti-static measures to keep it clean when performing DIP plug-in.

DIP plug-in processing is an important process of electronic processing, which has an important impact on ensuring the quality of electronic products, so relevant staff are required to be careful and meticulous in operation.